
3D IC and 2.5D IC Packaging Market Size to Record a CAGR of 7.8% | Taiwan Semiconductor and Samsung Electronics Company
The global 3D IC and 2.5D IC packaging market is expected to grow from USD 5100 Mn in 2019 to USD 8000 Million by 2025, at a CAGR of 7.8%. NEW YORK CITY, NEW YORK, UNITED STATES, August 12, 2022 /EINPresswire.com/ -- The increasing demand for …